Semiconductor Cooling and Thermal Management

1. Data Center Servers/AI Supercomputing/GPU Chips

Immersion Cooling: Fluorinated liquids (such as FC-40, Novec-7200) directly immerse server hardware, achieving efficient heat dissipation through high thermal conductivity (close to that of water) and low surface tension. This results in energy savings of over 85% compared to air cooling, with a PUE value below 1.1.

Dynamic Cooling: In chip aging tests, fluorinated liquids rapidly absorb transient heat loads, ensuring test accuracy and equipment stability.

2. Semiconductor Chillers

Used as a refrigerant for temperature control (±0.1℃ accuracy) in equipment such as lithography and etching machines, its thermal stability (liquid range -57~165℃) ensures reliable operation under extreme temperatures.

3. Plasma Etching and CVD Equipment

Electrode Cooling: Fluorinated liquids (such as FC-40) cool electrodes through single-phase or two-phase circulation, preventing equipment deformation caused by high-temperature plasma. Their non-conductive properties prevent short circuits.

4. Reaction Chamber Temperature Control: Maintains uniform reaction temperature in chemical vapor deposition (CVD), and material compatibility (compatible with metals/plastics) reduces the risk of equipment corrosion.

5. Ion Implanters and Testing Equipment

Fluorinated liquids (such as Novec-7100) are used to cool high-energy ion beam generation components; their chemical inertness prevents reactions with sensitive elements.

6. Single/Dual-Phase Cooling Systems

Single-Phase System: FC-40, with its narrow boiling range (compositional stability) and high dielectric strength, is used for semiconductor cold plate cooling, reducing fluid loss.

Dual-Phase System: Novec-7200 provides passive heat dissipation through an evaporation-condensation cycle (requiring no additional energy consumption), suitable for high-density GPU mining rigs and AI chip cooling.

7. Heat Pipe and Microchannel Cooling

Low surface tension allows fluorinated liquids to penetrate microscopic gaps, achieving precise chip-level heat dissipation coverage.

Furthermore, Key Features and Advantages:

1. Non-conductive: High dielectric strength (e.g., FC-40 dielectric strength >40kV) prevents current leakage and ensures equipment safety.

2. Thermally stable: Wide operating temperature range (-90~200℃) adapts to extreme environments; boiling point up to 165℃ (FC-40) ensures no decomposition at high temperatures.

3. Material compatibility: Compatible with metals, plastics, and sealing materials; no corrosion or swelling during long-term use.